| 摘要 |
PROBLEM TO BE SOLVED: To achieve a high accuracy in the alignment between a semiconductor bare chip and a planned position for mounting the chip on a printed-circuit board, regarding a device for mounting a semiconductor bare chip. SOLUTION: The device for mounting semiconductor bare chip comprises: mounting head 41 for holding the semiconductor bare chip 10; a stage 42 on which the printed-circuit board 20 is secured; a semiconductor-bare-chip-recognizing CCD camera 43 for recognizing a recognition mark 30 of the semiconductor bare chip held on the mounting head; a board-recognizing CCD camera 44 for recognizing a recognition mark 31 of the board secured to the stage; a mounting-head-moving mechanism 45 for moving the mounting head; a stage-moving mechanism 46 for moving the stage; internal temperature sensors 55 trough 59; and a control circuit 60. If the temperature detected by the temperature sensor 55 is below a predetermined temperature range, the control circuit 60 idles the device to raise the temperature, and, if the temperature is above the predetermined temperature range, then stops the operation of the device for mounting semiconductor bare chips to lower the temperature, thereby realizing a high accuracy in the alignment between a semiconductor bare chip and a planned position for mounting the chip on a printed-circuit board to be achieved. COPYRIGHT: (C)2004,JPO&NCIPI |
