SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, ELECTRONIC EQUIPMENT, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent the fusion of a bump electrode in the case of the secondary mounting of a carrier substrate.

SOLUTION: The bump electrode 17 having the melting point lower than the bump electrode 24 is formed on a land 12a mounted on the rear of the carrier substrate 11, and the bump electrode 17 is joined on the land 32 of a mother substrate 31 by conducting a reflow treatment at a temperature lower than the melting point of the bump electrode 24 and higher than the melting point of the bump electrode 17.

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