| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device having stable quality by preventing displacement of a die pad during resin sealing and residual strain in a semiconductor component, and also to provide a method of manufacturing the semiconductor device. <P>SOLUTION: In a semiconductor device, a pair of support leads 110 and a die pad 101 on which a semiconductor component 50 is mounted are formed integrally, and a projected portion 112 is formed on a surface of a respective support lead 110 on the mounted side of the semiconductor component 50. In sealing with resin, resin is applied to seal while the die pad 101 is placed so that its lower surface abuts the inner wall surface of a lower mold 82, and the projected portion 112 is positioned so that its top abuts the inner wall surface of an upper mold 81, respectively. Thereby, displacement of the die pad 101 is restrained during sealing, so that strain is not present in the semiconductor component 50. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
