发明名称 WIRING BOARD, ELECTRO-OPTICAL DEVICE, MANUFACTURING METHOD THEREOF AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To improve uniformity in film thickness of a functional layer (such as a light emitting layer, for example) of an operating element. SOLUTION: The electronic apparatus has a substrate, a plurality of wiring layers formed on the substrate and a plurality of electrodes formed to overlap with the wiring layers. A wiring pattern 30 which is positioned in any one of wiring layers has three or more wiring 31, 32, 33 parallel extending at equal intervals under the respective electrodes. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004260133(A) 申请公布日期 2004.09.16
申请号 JP20030379938 申请日期 2003.11.10
申请人 SEIKO EPSON CORP 发明人 AOKI KOJI
分类号 H01L51/50;G02F1/13;G02F1/1345;G02F1/1362;G09F9/30;H01L21/3205;H01L21/77;H01L23/52;H05B33/14;H05K1/02;H05K3/46;(IPC1-7):H05K3/46;H01L21/320 主分类号 H01L51/50
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