| 摘要 |
PROBLEM TO BE SOLVED: To improve a method for moving a chip from a chip carrier tape to another processing station, and a method for accommodating a carrier tape system to a flip-chip packaging. SOLUTION: A carrier tape system is designed for flip-chip assembling in which a chip 14 is loaded on a carrier tape 11 with a circuit side up in a normal manner, and the chip is picked from the tape 11 in single picking operation and placed with the circuit side down. The chip 14 is picked from a backside of the carrier tape 11. Next, a vacuum head of a picking tool 16 contacts to a backside of the IC chip 14, and dispenses (operates/distributes) the chip 14 with the circuit side down without additional handling. COPYRIGHT: (C)2004,JPO&NCIPI |
