CRYSTALLINE SILICON DIE ARRAY AND METHOD FOR ASSEMBLING CRYSTALLINE SILICON THIN FILM ON SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a crystalline silicon die array on a substrate having a maximum area of 2 m2, and to provide a method for manufacturing the array.

SOLUTION: The method for manufacturing the array comprises a process 1202 of describing an array of a die area on a crystalline semiconductor wafer; a process 1204 of implanting hydrogen ions in the die area; a process 1208 of forming a polymer layer so as to cover each die and forming a lamination which includes a die area first wafer layer; a process 1210 of polymerizing and coupling translucent carriers with the die area; a process 1212 of inducing breakage in the wafer by thermal annealing; a process 1214 of sequentially forming a wafer laminate second layer having a narrower layer thickness than that of the die for each die; and a process 1218 of adhering the wafer laminate second layer smoothly to the substrate.

COPYRIGHT: (C)2004,JPO&NCIPI