HEAT SINK DEVICE OF SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a heat sink device having the small radiation of high-frequency noise and an excellent heat sink effect even when a current flowing through a semiconductor element is large in the heat sink device of the semiconductor element used for an electric/electronic circuit. SOLUTION: The heat sink device mounted at the semiconductor element includes a first heat sink unit installed in close contact with the semiconductor element, and a second heat sink unit installed in close contact with the first heat sink unit. The first heat sink unit and the second heat sink unit are connected to a power supply circuit that supplies power to the semiconductor element by a first connecting means and a second connecting means. COPYRIGHT: (C)2004,JPO&NCIPI