发明名称 CIRCUIT MODULE
摘要 PROBLEM TO BE SOLVED: To provide a circuit module so as to reduce the effect of electromagnetic wave noise wherein electronic components are potting-coated with a resin protection body. SOLUTION: In the circuit module, the electronic components 16 are placed on a circuit wiring board 12, the components 16 are connected to an electrode pad 12a of prescribed wire conductors via bonding wires 17, a cylindrical frame 13 is placed to surround the electronic components 16 and the bonding wires 17, and the resin protection body 14 is filled in the frame 13. A shield conductor connected to a ground level is formed to the frame to shut off external noise, and the electronic components 16 are shielded from extraneous noise. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004259992(A) 申请公布日期 2004.09.16
申请号 JP20030049735 申请日期 2003.02.26
申请人 KYOCERA CORP 发明人 IWAMOTO KUNIHIDE
分类号 H01L23/00;(IPC1-7):H01L23/00 主分类号 H01L23/00
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