PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD

摘要

A process for producing a multilayer printed wiring board, comprising providing an unhardened or half-hardened resin layer from a hardening composition comprising an insulating polymer and a hardening agent, the resin layer superimposed on an internal layer substrate having a first conductor layer as an outermost layer; bringing the surface of the resin layer into contact with a compound having a structure capable of coordination with a metal; hardening the resin layer to thereby form an electrical insulator layer; oxidizing the surface of the obtained electrical insulator layer until the surface average roughness (Ra) of the electrical insulator layer falls within the range of 0.05 to less than 0.2 mum and the surface ten-point average roughness (Rzjis) thereof within the range of 0.3 to less than 4 mum; and forming a second conductor layer on the electrical insulator layer by plating operation. There is further provided a multilayer printed wiring board produced by the process. This multilayer printed wiring board excels in pattern adhesion to substrates, even those of large size.