| 发明名称 |
SUBSTRATE PROCESSING SYSTEM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
<p>With the present invention, water adhered to a substrate during cleaning process is completely removed and the water-free substrate is conveyed to a film-forming apparatus. A substrate processing system (1) comprises a cleaning apparatus (3) for cleaning a substrate with a cleaning liquid, a water removing apparatus (4) for removing water adhering to the substrate which has been cleaned by the cleaning apparatus (3), and a conveyance portion (7) for carrying the substrate, from which water has been removed by the water removing apparatus (4), through a drying atmosphere to another processing apparatus.</p> |
| 申请公布号 |
WO2004079808(A1) |
申请公布日期 |
2004.09.16 |
| 申请号 |
WO2004JP02705 |
申请日期 |
2004.03.04 |
| 申请人 |
TOKYO ELECTRON LIMITED;OHMI, TADAHIRO;TERAMOTO, AKINOBU |
发明人 |
OHMI, TADAHIRO;TERAMOTO, AKINOBU |
| 分类号 |
H01L21/677;H01L21/00;H01L21/304;H01L21/306;H01L21/31;(IPC1-7):H01L21/304;H01L21/68 |
主分类号 |
H01L21/677 |
| 代理机构 |
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