| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve space saving by reducing the size of an electronic device containing a high-frequency device using a superconductor and, in addition, to reduce the heat load of a cooling facility which cools the electronic device. <P>SOLUTION: The electronic device is provided with an electronic element in which superconducting wiring 13 is formed on a dielectric substrate 12 and, at the same time, a superconducting grounding film 18 is provided on the other surface of the substrate 12 and an metallic enclosure 11 which is constituted to install the electronic element and has a grounding section connected to the superconducting grounding film 18 when the electronic element is installed, center conductors 15a and 15b connected to the wiring 13, and a pressing means which presses the electronic element toward the grounding section. The center conductors 15a and 15b are formed to have elasticity and the pressing means presses the electronic element toward the grounding section by utilizing the elastic forces of the conductors 15a and 15b. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
