| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a desired chip resistor having an external electrode even on the outer surface of each of both longitudinal ends efficiently and inexpensively. SOLUTION: A large-sized substrate 31 having an upper surface electrode 24, a lower surface electrode 27, a resistor 23 and a previously formed protective film 25, is fixed onto a support base 32, and is divided into a lattice state by dicing, etc. Thus, the large-sized substrate 31 is divided into many chip units 20 adjacently via dividing grooves 33 of a predetermined width. Thereafter, the side face central parts of the protective film 25 and the chip units 20 continued to the protective film 25 are sputtered in a masked state. Conductive metal films are simultaneously formed on all the outer surfaces except the lower surfaces of the chip units 20 and the masked region to obtain a metal film 26, an end face electrode 28 and a side end face electrode 29. The chip units 20 separated from the support base 32 are plated to obtain multiple completed chip resistors 21. COPYRIGHT: (C)2004,JPO&NCIPI
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