| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a propagation mode and a characteristic impedance fluctuate at the connection point between a line conductor of a dielectric board composing a package and a wiring conductor of an external circuit board. SOLUTION: A package for storing an optical semiconductor element comporises a dielectric board 1 which is composed of a plurality of laminated dielectric layers 1a and has a mounting part for the optical semiconductor element S on its one end, a first line conductor 2 which is formed on the dielectric board 1 with its end connected to an electrode of the optical semiconductor element S, a second line conductor 3 and an identical plane grounding conductor layer 5 on its both side which are formed beneath the dielectric board 1 and connected to the first line conductor 2 by a penetrating conductor 4, a grounding conductor layer 6 which is formed in the dielectric board 1 and connected to the identical plane grounding conductor layer 6 by a plurality of penetrating conductors 7 for grounding, and a cap 12. A connection point between the second line conductor 3 and the penetrating conductor 4 positions over the external circuit board 8, and the identical plane grounding conductor layer 5 is extended in the region where the first line conductor 2 is in opposition to the external circuit board 8. COPYRIGHT: (C)2004,JPO&NCIPI
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