| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface treatment device and a surface treatment method by which the stable quality of a plating film can be obtained by suppressing the concentration of potentials in a work without depending on the shape and size of the work and the fact whether or not the work has an appearance subjected to surface treatment. SOLUTION: In the surface treatment device 1, the space between an electrode on an anode side (such as an anode 10) and the faces to be treated in a work on a cathode side (such as the inside facesαandβin the bores of cylinder blocks 2 and 3) is filled with a surface treatment liquid (such as a plating liquid 13), and electric current is applied thereto, so that the faces to be treated in the work are subjected to surface treatment. A pallet 4 which can be carried in and out to the surface treatment device body in a state where the work is set is provided, and the work is connected to the cathode (such as the cathode terminal 23 of a power source 22) via the pallet 4. COPYRIGHT: (C)2004,JPO&NCIPI
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