发明名称 Ultraviolet irradiating method and an apparatus using the same
摘要 An ultraviolet irradiating apparatus for emitting ultraviolet light toward a work piece. The work piece, e.g. a semiconductor wafer, is held by a ring-shaped frame through an ultraviolet sensitive adhesive tape applied to the back surface of the wafer. The apparatus includes an ultraviolet irradiating section having a regulating member disposed in a lower position of a support base. The regulating member is provided to limit a downward displacement of the wafer.
申请公布号 US2004180515(A1) 申请公布日期 2004.09.16
申请号 US20040776221 申请日期 2004.02.12
申请人 OKAWA YUJI 发明人 OKAWA YUJI
分类号 H01L21/00;H01L21/301;(IPC1-7):H01L21/301 主分类号 H01L21/00
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