| 摘要 |
<p>An adhering and releasing method for protective tape, comprising the steps of cutting the protective tape adhered onto the front surface of a wafer suckingly held on a chuck table by a tape adhering mechanism in a wafer shape by a cutter unit, adhering a protective tape having adhesion less than that of the first sheet of protective tape on the protective tape, and releasing the multi-layered protective tapes one by one, in order, from the upper side by a tape releasing device (15) after the thinning treatment of the water is completed.</p> |
