发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION AND CURING PRODUCT THEREOF |
摘要 |
A photosensitive resin composition that excels in sensitivity to actinic energy rays (photosensitivity), is hardenable within a short period of time and can form pattern through development with a dilute aqueous alkali solution and that gives a cured film through thermal curing in the postcuring step, the cured film having satisfactory flexibility and being suitable to a solder mask ink of high insulation excelling in adherence and resistances to gold plating, electroless gold plating and tin plating; and a curing product thereof. In particular, a photosensitive resin composition characterized by comprising (1) a urethane resin soluble in aqueous alkali solutions (A), the urethane resin obtained by urethanizing in the absence of catalyst a diisocyanate compound (a), a diol compound having an ethylenically unsaturated group in its molecule (b) and a diol compound having a carboxyl group in its molecule (c) optionally together with a diol compound not having any ethylenically unsaturated group or carboxyl group in its molecule (d) and reacting the reaction product with a cyclic acid anhydride (e); (2) a photopolymerization initiator (B); and (3) a reactive crosslinking agent (C).
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申请公布号 |
WO2004079452(A1) |
申请公布日期 |
2004.09.16 |
申请号 |
WO2004JP02718 |
申请日期 |
2004.03.04 |
申请人 |
NIPPON KAYAKU KABUSHIKI KAISHA;TANAKA, RYUTARO;KOYANAGI, HIROO |
发明人 |
TANAKA, RYUTARO;KOYANAGI, HIROO |
分类号 |
C08F290/06;C08G18/48;C08G18/50;C08G18/77;C09J175/04;G03F7/027;G03F7/038;(IPC1-7):G03F7/027;C08G18/67;G03F7/035 |
主分类号 |
C08F290/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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