| 摘要 |
PROBLEM TO BE SOLVED: To guarantee soldering at or below a heat resistant temperature of a plurality of electronic components, and to provide a local soldering and local heating soldering device with a solder melting detection function. SOLUTION: At the time of locally soldering a joining object electronic component Da to a wiring board P near a low heat resistant electronic component Db whose heat resistant temperature is lower than that of the joining object electronic component Da. Such a method is adopted that the wiring board P, the joining object electronic component Da and the main body of the low heat resistant electronic component Db are heated by heat from solder Sa melted by a heating source 11, the temperature rise is measured by a first non-contact temperature sensor 21, the temperature of the heating source 11 is controlled so as to solder the joining object electronic component Da during soldering and the main body of the low heat resistant electronic component Db at or below the heat resistant temperatures, and heating by the heating source 11 is stopped in the case of detecting the state that the melted solder Sa becomes low emissivity in a second non-contact temperature sensor 22. COPYRIGHT: (C)2004,JPO&NCIPI
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