| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring design system allowing relatively reasonable wiring design, and capable of creating a reasonable and high-density wiring pattern in a single-layer board. SOLUTION: A wiring preprocessing part 1 previously properly organizes a wiring condition in relation to a part allowing a physical condition in terms of wiring and packaging in an original circuit. A feedback part 2 feeds back information for pin allocation to a packaging design system of components of upper tiers in the original circuit to change the pin allocation by design of the components themselves of the upper tiers. An automatic wiring part 3 specifically designs a wiring pattern increased in density by using as few interlayer connection path as possible. A wiring sequence determination part 32 determines the wiring sequence of a wiring bundle. A detailed wiring part 33 creates a wiring pattern of a printed circuit board by sequentially arranging respective connection wires. COPYRIGHT: (C)2004,JPO&NCIPI
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