| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component assembling method capable of securing sufficient airtightness by firmly attaching a cover to a case even when the size and height of an electronic component are reduced, effectively preventing the generation of characteristic defects due to inflow of adhesive, eliminating the necessity of managing the discharge quantity of adhesive, and obtaining an electronic component having high reliability and high productivity. SOLUTION: In the electronic component assembling method, an outer cover 2b consisting of thermoplastic resin similar to that of a case body 2a is heated/softened, one main surface of the outer cover 2b is bonded with an inner cover 5, the outer peripheral part of the outer cover 2b is bonded with the case body 2a, and then the outer cover 2b is cooled/cured, so that the inner cover 5 is firmly fixed by the outer cover 2b while the inner cover 5 closes an aperture of the cavity part 3 to seal the cavity part 3 airtightly. Thus, the electronic component having high reliability and high productivity can be obtained. COPYRIGHT: (C)2004,JPO&NCIPI
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