发明名称 |
Thermal interface material |
摘要 |
A composition for use as a thermal interface material in a heat-generating electronic device is provided. The composition comprises a blend of fluoroelastomer components that are copolymers of hexafluoropropylene and vinylidene and consists of greater than 40% fluorine along the backbone, and conductive filler particles. The blend contains at least one component with a Mooney viscosity of 50 poise or less and at least one component with a Mooney viscosity of greater than 50 poise.
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申请公布号 |
US2004180209(A1) |
申请公布日期 |
2004.09.16 |
申请号 |
US20030388028 |
申请日期 |
2003.03.12 |
申请人 |
CHENG CHIH-MIN;COLLINS ANDREW |
发明人 |
CHENG CHIH-MIN;COLLINS ANDREW |
分类号 |
B32B27/00;C08K3/00;C08L33/04;(IPC1-7):B32B27/00 |
主分类号 |
B32B27/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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