发明名称 DEVICE AND METHOD FOR SURFACE TREATMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a device and a method for surface treatment which facilitate surface treatment of various objects to be treated owing to an easy in-line arrangement and an enabled volume adjustment of a plasma discharge region in a device for manufacturing the object to be treated. <P>SOLUTION: The surface treatment device 10 is provided, wherein surface treatment is given to the object 40 to be treated with excited active species produced in the plasma discharge region 30 under an atmospheric pressure or a pressure close thereto. The device comprises an application electrode 11, a ground electrode 13, a dielectric body 14 for allowing a surface of the object 40 to be exposed to the excited active species produced in the plasma discharge region 30 which has been formed by applying high frequency AC power on the application electrode 11 arranged on one surface 50 together with the application electrode 11 and the ground 13 and thus by causing creeping discharge on the other surface 51, and a to-be-treated object conveyer 20 for conveying the object 40 and having it passed through the plasma discharge region 30. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004259987(A) 申请公布日期 2004.09.16
申请号 JP20030049686 申请日期 2003.02.26
申请人 SEIKO EPSON CORP 发明人 ASANO YASUHIKO
分类号 H05H1/24;B01J19/08;C23F4/00;H01L21/3065 主分类号 H05H1/24
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