发明名称 APPARATUS AND METHOD FOR WAFER ALIGNMENT WITH REDUCED TILT SENSITIVITY
摘要 PROBLEM TO BE SOLVED: To provide a wafer alignment apparatus having reduced tilt sensitivity related to tilt of optical markers on a wafer. SOLUTION: A substrate alignment system comprises a light source generating incoming light beams IB and IB2, which fall on a substrate composed of gratings positioned so as to generate at least one diffraction order, and optical equipment 1 which forms an image according to at least one diffraction order with a sensor device DET. The system is equipped with an aperture means TA, having apertures PH1 and PH2 at predetermined positions to pass structure-diffracted beams DB1 and DB2, the structure-diffracted beams DB1 and DB2 have diffracted beam diameters BD1 and BD2 on the faces of the apertures PH1 and PH2, respectively; and the diffracted beam diameters BD1 and BD2 are greater than the diameters of the apertures PH1 and PH2, respectively. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004260163(A) 申请公布日期 2004.09.16
申请号 JP20040036909 申请日期 2004.02.13
申请人 ASML NETHERLANDS BV 发明人 VAN DER ZOUW GERBRAND
分类号 G03F9/00;H01L21/027;(IPC1-7):H01L21/027 主分类号 G03F9/00
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