| 摘要 |
PROBLEM TO BE SOLVED: To provide bonding method for efficiently mounting a mounting member on a substrate, and a device for the method. SOLUTION: An elastic member 6 is interposed between chips 4 and a head 12 so as to cover the plurality of arrayed chips 4 and is pressed from the upper part of the same by the head 12. In this case, the elastic member 6 absorbs the variety of thicknesses of each chips 4 and the chips 4 are pressed evenly, while only the rear surface part of the substrate, on which the chips 4 are mounted is heated by a heating means below the substrate 2 whereby resin is heated and cured. Accordingly, the plurality of chips 4 can be mounted simultaneously on the substrate 2 and a stress, given to the whole of the substrate, can be avoided. COPYRIGHT: (C)2004,JPO&NCIPI
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