发明名称 HEAT RADIATION STRUCTURE OF ELECTRONIC DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide the heat radiation structure of an electronic device, which is improved in the discharging efficiency of the heat generated by the electrical devices. <P>SOLUTION: The heat radiation structure of the electronic device is constituted of a heat radiation unit 7, in which a plurality of heat radiation holes 7a are arranged in pairs of left and right rows while the heat radiation hole 7a is constituted of a front inflated part 9a whose upper spherical part is inflated forward, a rear inflated part 9b whose lower spherical part is inflated rearward, and a hole 9c formed between the inflated parts 9a, 9b. The area of the heat discharging hole 9c is increased double compared with a conventional hole, and an electrical component unit as well as an imaging unit can be sufficiently cooled. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p>
申请公布号 JP2004259916(A) 申请公布日期 2004.09.16
申请号 JP20030048710 申请日期 2003.02.26
申请人 FUJITSU GENERAL LTD 发明人 MATSUMOTO KAZUO
分类号 H05K7/20;H01L23/36;(IPC1-7):H05K7/20 主分类号 H05K7/20
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