| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for a low-temperature curing prepreg which can solve the problems of a hand lay-up type on safety and sanitation, troublesomeness, curing characteristics and the like, and to provide the prepreg. SOLUTION: This epoxy resin composition for a low-temperature curing prepreg comprises following components A, B and C as its essential components. The component A is an epoxy compound having at least two glycidyl groups in a molecule. The component B is an inclusion compound on which an amine compound having active hydrogen is adsorbed and which is fully or partially covered with an organic polymer whose melting or softening point is 40-100°C. The component C is a compound which can be a dismissal agent of the amine compound for the inclusion compound of the component B. A low-temperature curing prepreg is obtained by impregnating a fiber with the epoxy resin compound. COPYRIGHT: (C)2004,JPO&NCIPI |
