| 摘要 |
PROBLEM TO BE SOLVED: To provide a high quality and high precision pattern wiring board or a device substrate. SOLUTION: A liquid drop ejector 1 imparts a plurality of liquid drops of a solution containing microparticles to a substrate 14 by means of an ejection head 11 and forms pattern wiring or a device by evaporating volatile components of the liquid drop. Surface roughness on the patterning surface of the substrate is set rougher than sizes of the microparticles. Assuming the size of the microparticles is Dp and the diameter of an ejection opening is Do, a following relation is satisfied 0.0001≤Dp/Do≤0.01. The ejection head ejects the solution by the growing action force of a film boiling bubble generated instantaneously in the solution wherein the drop under flying is elongated five times as long as its diameter in the flying direction and a relative moving speed between the substrate and the ejection head is set not higher than one third of the ejecting velocity of the solution. The pattern is formed by combining dots and the end is connected electrically with a pattern formed previously on the substrate. A dot at the most end covers a dot formed previously by half dot or further previously. COPYRIGHT: (C)2004,JPO&NCIPI
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