| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which inhibits short wavelength absorption, excels in ultraviolet resistance, weatherability, and reflecting properties, and can be used in assembling a semiconductor device mounting an optical semiconductor chip and bonding various types of parts, and an adhesive for optical semiconductors using the same. SOLUTION: The epoxy resin composition comprises 3-70 wt.% alicyclic epoxy resin (A), 0.5-30 wt.% hydrazide curing agent (B), and 3-90 wt.% light reflecting inorganic filler (C). As the light reflecting inorganic filler (C), an inorganic particle filler having a band gap energy of≥2.8 eV or at least one metallic powder of Ag, Pt, and Al is used. COPYRIGHT: (C)2004,JPO&NCIPI
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