| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive resin composition which, when molded, gives a molded article hardly causing, for example, the adhesion of fine particles to the surface of an enclosed object and having a low anisotropy and a good dimensional stability. SOLUTION: The conductive resin composition contains 70-90 mass% polybutylene terephthalate and 30-10 mass% milled carbon fiber having a volume resistivity of 1×10<SP>-1</SP>Ωcm or lower and an aspect ratio of 20 or lower. COPYRIGHT: (C)2004,JPO&NCIPI
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