Solder on a sloped surface

摘要

A method for depositing a solder layer or solder bump on a sloped surface. The method includes etching a sloped surface on a planar semiconductor substrate, depositing a solder-wettable layer on the sloped surface, masking the wettabler layer with a coating layer to control the position of the solder deposition, and using an organic film to prevent the solder from being deposited at regions not above either the wettable layer or the coating layer. Also, a semiconductor device structure on which a solder layer or solder bump is formed exclusively on a sloped surface.