发明名称 PACKAGE FOR HOUSING LIGHT EMITTING ELEMENT, AND LIGHT EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a package for housing a light emitting element which allows light emitted from a light emitting element to be reflected well on the internal perimeter of a frame body and then to be efficiently and evenly emitted outside, and which can provide stable optical characteristics with no change in light intensity, emission angle of light, and light intensity profile due to a temperature change. <P>SOLUTION: The package for housing the light emitting element comprises a substrate 2 which has a mounting portion 2a to mount the light emitting element 5 at the center of an upper principal plane, and which is formed with a wiring conductor 3 derived outside from the mounting portion 2a; a metal frame body 4 which is installed in the periphery of the upper principal plane of the substrate 2 so as to surround the mounting portion 2a, and which has an internal face which is a tilted surface gradually expanded as it goes upwards; and a heat slinger 6 made of metal which is bonded to the center of a lower principal plane of the substrate 2. <P>COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004259958(A) 申请公布日期 2004.09.16
申请号 JP20030049341 申请日期 2003.02.26
申请人 KYOCERA CORP 发明人 YANAGISAWA MITSUO
分类号 H01L23/02;H01L23/08;H01L33/58;H01L33/60;H01L33/62;H01L33/64 主分类号 H01L23/02
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