| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer circuit board wherein conductive layers are provided at least on the surface of a ceramic insulating circuit board, and connection reliability of conductor layers provided over the surface of the ceramic insulating circuit board is never lowered, due to cracks or flaws by de-particle on the surface of a ceramic insulating circuit board generated by the blast process on the multilayer circuit board in which a conductive layer is provided on the surface of at least ceramic insulating circuit board. SOLUTION: In the multilayer circuit board 2, the conductive layer 3 is formed at least on the surface of the ceramic insulating circuit board 2 formed by laminating the ceramic insulating layers 2a to 2d. A ceramic layer 6, which can be sintered under a low temperature and ensuring that amount of glass, for example, is larger than that in the ceramic insulating layers 2a to 2d and a softening point of glass is lower than that of glass in the ceramic insulating layers 2a to 2d, is formed in such a form as covering a part of the external circumference of the conductive layer 3. COPYRIGHT: (C)2004,JPO&NCIPI |
