| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that electric short-circuiting takes place between connection pads through solder bridges formed due to intricate warping of the entire wiring board or high density connection pads. SOLUTION: In the wiring board 4 where wiring conductors are formed in a square ceramic insulating substrate 1 and multiple connection pads 2, connected electrically with the wiring conductors, are formed on one major surface of the insulating substrate 1, a recessed level difference part is formed in each of two opposing side faces of the insulating substrate 1 such that the level difference part becomes narrower gradually from the lower end to the way of the side face of the insulating substrate 1 and a reinforcing dummy pad 3 is formed of a metallized conductor on the inner surface of the level difference part. Since a stress applied to the connection pad 2 can be relaxed effectively by the reinforcing dummy pad 3, the connection pad 2 can be electrically connected surely with the terminal pad of an external electric circuit board over a long term. COPYRIGHT: (C)2004,JPO&NCIPI
|
