发明名称 |
Interposer, interposer package and device assembly employing the same |
摘要 |
An interposer, interposer package and device assembly employing the same are provided. The interposer has a substrate formed of a semiconductor material, with first input/output contacts disposed over a first main surface thereof and second input/output contacts disposed over a second main surface thereof. The second input/output contacts are electrically connected to the first input/output contacts. The first input/output contacts disposed over the first main surface of the interposer substrate are for attachment to input/output pads of a device to which the interposer is to be attached. The second input/output contacts disposed over the second main surface of the interposer substrate facilitate electrical coupling to a component to which the interposer is also to be attached.
|
申请公布号 |
US2004178484(A1) |
申请公布日期 |
2004.09.16 |
申请号 |
US20030388997 |
申请日期 |
2003.03.14 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
BURDICK WILLIAM E.;ROSE JAMES W. |
分类号 |
H01L23/32;H01L23/36;H01L23/498;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/32 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|