MOLDING DIE ENABLING SEMICONDUCTOR PACKAGES TO BE MARKED TO PERFORM SIMULTANEOUSLY MOLDING AND MARKING

摘要

PURPOSE: A molding die enabling semiconductor packages to be marked is provided to perform simultaneously a molding process and a marking process by using a marking member including a character and a picture. CONSTITUTION: A semiconductor package molding die includes an upper molding die part having the first cavity and a lower molding die part having the second cavity corresponding to the first cavity. The upper molding die part includes the first block(21), a marking member(23) which is installed at a lower part of the first block, and the second block(24) which is installed at a lower part of the marking member. A predetermined character and a predetermined picture are printed on the opposite side of the marking member to the first block.