| 摘要 |
PROBLEM TO BE SOLVED: To attain magnetic coupling substantially similar to that of a closed circuit and a high common impedance while enhancing adhesion of a magnetic substrate. SOLUTION: An insulation layer and a coil pattern including coil conductor layers 5 and 7 are formed alternately on a first magnetic substrate 1, central region of each insulation layer surrounded by the coil pattern and the insulation layer part in the outer circumferential region of the coil pattern are removed, resin (magnetic layer 11) containing magnetic powder is provided on the top insulation layer and also buried in the part from where the insulation layer is removed, and then a second magnetic substrate 13 is bonded to the flattened surface of the resin containing magnetic powder through an adhesive layer 12. COPYRIGHT: (C)2004,JPO&NCIPI
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