发明名称 Method and apparatus for processing substrates and method for manufacturing a semiconductor device
摘要 A substrate processing apparatus includes a housing, a process tube for performing variable batch processes on substrates, and product substrate carriers. The product substrate carriers have a capacity of a predetermined number of substrates. A number of the product substrates processed during one batch process are less than or equal to the predetermined number of the substrates. All of the product substrates contained in one product substrate carrier is processed in the process tube at a same time.
申请公布号 US2004177926(A1) 申请公布日期 2004.09.16
申请号 US20030674345 申请日期 2003.10.01
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 MATSUNAGA TATSUHISA;TERAMOTO MASAHIRO;AKUTSU NORIO;NOTO KOUICHI
分类号 C23C16/44;C23C16/54;H01L21/205;H01L21/22;H01L21/285;H01L21/31;H01L21/673;H01L21/677;H01L21/683;H01L21/687;(IPC1-7):C23F1/00 主分类号 C23C16/44
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