发明名称 |
METHOD OF ASSEMBLING A SEMICONDUCTOR DEVICE INCLUDING SWEEPING (WITH A SQUEEGEE) ENCAPSULANT OVER THE DEVICE REPEATEDLY |
摘要 |
A method of assembling a semiconductor device forming an encapsulant. The method includes providing a substrate having a plurality of semiconductor devices, respectively connecting a semiconductor chip electrically to a predetermined encapsulation area on a surface of the substrate, filling an encapsulant overlying the predetermined encapsulation area using stencil printing, sweeping excess encapsulant over the predetermined encapsulation area at a first air pressure below approximately 1 atm, sweeping encapsulant overlying the predetermined encapsulation area over the encapsulant overlying the predetermined encapsulation area using stencil printing at a second air pressure above the first air pressure, and hardening the encapsulant at a third air pressure above approximately 1 atm.
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申请公布号 |
US2004180472(A1) |
申请公布日期 |
2004.09.16 |
申请号 |
US20030619334 |
申请日期 |
2003.07.14 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
CHEN KAI-CHI;LI HSUN-TIEN |
分类号 |
H01L21/56;H01L23/31;H01L25/065;(IPC1-7):H01L21/48;H01L21/00;H01L21/50;H01L21/44 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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