| 摘要 |
A bonding method using an anisotropic conductive adhesive, comprising the steps of forming an adhesive coating layer (4) on and along the surface (1a), having metal joint parts (2), of at least one (1) of objects to be bonded when bonding objects with metal joint parts to each other, spreading conductive particles (5) onto the surface (4a) of the adhesive layer, and thereafter bonding the metal joint parts to each other. The method can efficiently restrict conductive particles from escaping from bonding portions before and during bonding the objects to each other, ensure a sufficient number of conductive particles between the metal joint parts to be bonded to each other, and prevent conductive particles causing short circuiting from existing between adjacent metal joint parts, and easily accommodate the fining and fine pitching of metal joint parts.
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