发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND CURED COATING FILM
摘要 A photosensitive resin composition which comprises a resin (A1) having a group containing a fluorine atom, a group containing a silicon atom and an ethylenic double bond, a radical initiator (B) and an alkali-soluble photosensitive resin (D) having three or more ethylenic double bonds in a molecule; and a photosensitive resin composition which comprises a resin (A2) having a group containing a fluorine atom and an ethylenic double bond, a resin (A3) having a group containing a silicon atom and an ethylenic double bond, a radical initiator (B) and an alkali-soluble photosensitive resin (D) having three or more ethylenic double bonds in a molecule.
申请公布号 WO2004079454(A1) 申请公布日期 2004.09.16
申请号 WO2004JP02732 申请日期 2004.03.04
申请人 ASAHI GLASS COMPANY LIMITED;TAKAHASHI, HIDEYUKI;ISHIZEKI, KENJI 发明人 TAKAHASHI, HIDEYUKI;ISHIZEKI, KENJI
分类号 C08F8/00;G03F7/004;G03F7/027;G03F7/031;G03F7/033;G03F7/075 主分类号 C08F8/00
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