发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION AND CURED COATING FILM |
摘要 |
A photosensitive resin composition which comprises a resin (A1) having a group containing a fluorine atom, a group containing a silicon atom and an ethylenic double bond, a radical initiator (B) and an alkali-soluble photosensitive resin (D) having three or more ethylenic double bonds in a molecule; and a photosensitive resin composition which comprises a resin (A2) having a group containing a fluorine atom and an ethylenic double bond, a resin (A3) having a group containing a silicon atom and an ethylenic double bond, a radical initiator (B) and an alkali-soluble photosensitive resin (D) having three or more ethylenic double bonds in a molecule. |
申请公布号 |
WO2004079454(A1) |
申请公布日期 |
2004.09.16 |
申请号 |
WO2004JP02732 |
申请日期 |
2004.03.04 |
申请人 |
ASAHI GLASS COMPANY LIMITED;TAKAHASHI, HIDEYUKI;ISHIZEKI, KENJI |
发明人 |
TAKAHASHI, HIDEYUKI;ISHIZEKI, KENJI |
分类号 |
C08F8/00;G03F7/004;G03F7/027;G03F7/031;G03F7/033;G03F7/075 |
主分类号 |
C08F8/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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