Power MOSFET's and fabrication processes for power MOSFET's use a continuous conductive gate structure within trenches to avoid device topology problems caused when a gate bus extends above a substrate. The conductive gate structure forms trench gates in an active device region and forms a gate bus in a gate bus trench. The gate bus trench connects to device trenches and can be wide to facilitate forming a contact to the gate bus. The device trenches can be narrow to maximize device density. The gate bus and/or gates can contain a metal/silicide to reduce resistance, and polysilicon can surround the metal/silicide to prevent metal atoms from penetrating the gate oxide layers. A CMP process can planarize the conductive gate structure and/or overlying insulating layers. The processes are compatible with forming self-aligned or conventional contacts in the active device region.
申请公布号
WO2004079794(A2)
申请公布日期
2004.09.16
申请号
WO2004US06621
申请日期
2004.03.04
申请人
ADVANCED ANALOGIC TECHNOLOGIES INC.;ADVANCED ANALOGIC TECHNOLOGIES (HONG KONG) LIMITED;WILLIAMS, RICHARD K.;CORNELL, MICHAEL E.;CHAN, WAI TIEN
发明人
WILLIAMS, RICHARD K.;CORNELL, MICHAEL E.;CHAN, WAI TIEN