SEMICONDUCTOR FABRICATION APPARATUS AND OPERATION METHOD THEREOF TO PREVENT CONCENTRATION OF THERMAL AND PHYSICAL STRESS TO SUPPORTING POINT

摘要

PURPOSE: A semiconductor fabrication apparatus and operation method thereof are provided to remove mechanical defects due to deformation of a semiconductor substrate by preventing concentration of thermal and physical stress to a supporting point. CONSTITUTION: A reaction tube(30) is used for performing a high-temperature process and includes an internal cylindrical region. A dual boat is installed in the inside of the reaction tube. A plurality of semiconductor substrates are loaded into the dual boat. The dual boat is formed with the first substrate loading boat for supporting edges of the semiconductor substrates and the second substrate loading boat adjacent to the first substrate loading boat. A substrate holder(25) is loaded on the second substrate loading boat and is used for supporting each center part of the semiconductor substrates. An interval controller(60) is loaded into a lower part of the dual boat in order to control edges of the semiconductor substrates by operating one of the first and the second substrate loading boats.