| 发明名称 |
CIRCUIT BOARD, SEMICONDUCTOR DEVICE, SEMICONDUCTOR PRODUCTION SYSTEM, METHOD FOR PRODUCING CIRCUIT BOARD AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To increase the clearance between the edge part of a semiconductor chip and the lead terminal of a tape substrate while suppressing the height of a bump electrode. <P>SOLUTION: Boundary part of a semiconductor chip mounting region is pulled into a suction groove 17 by sucking the tape substrate 31 through the suction groove 17 and a curved part 31a arranged in correspondence with the edge part of the semiconductor chip 35 is formed on the tape substrate 31. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
| 申请公布号 |
JP2004259921(A) |
申请公布日期 |
2004.09.16 |
| 申请号 |
JP20030048816 |
申请日期 |
2003.02.26 |
| 申请人 |
SEIKO EPSON CORP |
发明人 |
TAKANO MICHIYOSHI |
| 分类号 |
H01L23/12;H01L21/48;H01L21/56;H01L21/60;H01L23/13;H01L23/498;H01L29/06 |
主分类号 |
H01L23/12 |
| 代理机构 |
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