| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method and a means which simultaneously satisfy a plating pretreatment and a punching capability of IVH, which become a problem when copper foil is thinned, and which manufacture a printed wiring board with less surface unevenness of an insulating layer. <P>SOLUTION: The manufacturing method of the printed wiring board has a process for manufacturing a conductor circuit by plating using the copper foil on insulating resin as a feeding layer. The copper foil is not thicker than 3μm, and a metal layer except the copper foil is formed on the surface not in contact with the insulating resin of the copper foil. The metal layer except the copper foil is punched from above by laser irradiation. The metal layer except the copper foil is selectively the dissolved. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
