| 摘要 |
PROBLEM TO BE SOLVED: To solve faults of both of an electrochemical polishing (ECP) process and an electrochemical and mechanical polishing (ECMP) process by efficiently polishing an excess copper film deposited on the surface of a substrate while preventing deterioration of quality of products. SOLUTION: The electrolytic polishing apparatus comprises: a substrate holding portion 16 for holding a substrate W; a polishing bath 14 for storing polishing fluid 12; a cathode plate 18 which has a large number of anodes 22 buried therein in the insulated state with insulating elements 20 and is immersed in the polishing fluid 12 stored in the polishing bath 14 and is arranged so as to face the substrate W held by the substrate holding portion 16; a polishing pad 36 which is arranged so as to be immersed in the polishing fluid 12 stored in the polishing bath 14 and has a conductive pad 34 and a non-conductive pad 32, the conductive pad 34 being electrically connected with the anodes 22 and being mounted on the surface of the cathode plate 18 so as to be exposed to the surface thereof; and a relative movement mechanism for relatively move the polishing pad 36 and the substrate W held by the substrate holding portion 16. COPYRIGHT: (C)2004,JPO&NCIPI
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