发明名称 |
Apparatus for cleaning a substrate having metal interconnects |
摘要 |
The present invention relates to a cleaning apparatus which can reduce a potential difference between metals or alloys used to form interconnects on a substrate for thereby minimizing corrosion which may occur during and after a substrate cleaning process. The cleaning apparatus for cleaning a substrate having metal interconnects comprises a cleaning mechanism for cleaning the substrate, and a functional water supply mechanism for supplying functional water to the cleaning mechanism. The cleaning mechanism cleans a surface of the substrate with use of the functional water.
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申请公布号 |
US2004177655(A1) |
申请公布日期 |
2004.09.16 |
申请号 |
US20040795434 |
申请日期 |
2004.03.09 |
申请人 |
KODERA MASAKO;ITO KENYA;KAMEZAWA MASAYUKI;HAMADA SATOMI;KATAKABE ICHIRO |
发明人 |
KODERA MASAKO;ITO KENYA;KAMEZAWA MASAYUKI;HAMADA SATOMI;KATAKABE ICHIRO |
分类号 |
H01L23/52;B08B1/04;B08B3/02;B08B3/04;B08B3/08;B08B3/12;C23G3/00;H01L21/00;H01L21/302;H01L21/304;H01L21/3205;(IPC1-7):D06F29/00 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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