| 摘要 |
A printed circuit comprises : a) a first surface (S1) comprising : - a micro-module of dual-interface type, the dual-interface comprises a contact interface and a contact- less interface, the contact interface comprising first contact areas (11, 12, 13, 14, 15, 16, 17, 18) disposed on a upper side of the printed circuit (19) and the contact-less interface comprising second contact areas (2, 3) disposed on a lower side of the printed circuit (19), - a chip (1) connected to the first contact areas (11, 12, 13, 14, 15, 16, 17, 18) of the contact interface and to the second contact areas (2, 3) of the contact-less interface, and b) a second surface (S2) encompassing the first surface (S1), the second surface comprising a connection means (4, 5, 4bis, 5bis) connecting the second contact areas (2, 3) of the contact-less interface to a part of the first contact areas (11, 12, 13, 14, 15, 16, 17, 18) of the contact interface. |
