PROBING APPARATUS AND PROBING METHOD TO PREVENT A NONCONTACT STATE BETWEEN PROBE NEEDLE AND ELECTRODE PAD OF WAFER

摘要

PURPOSE: A probing apparatus and a probing method are provided to enhance the reliability by preventing a noncontact state between a probe needle and an electrode pad of a wafer due to deformation of a probe card. CONSTITUTION: A wafer is loaded on a substrate fixing plate(5). The substrate fixing plate is moved to an X-axis, a Y-axis, and a Z-axis or is rotated to the predetermined direction on an alignment stage(7). A probe card(11) is installed at an upper side of the alignment stage. A probe needle is installed at a lower side of the alignment stage. A test head(19) is installed at an upper part of the probe card in order to apply a test signal. A tester(21) is used for transmitting a test signal to the test head and an alignment stage drive signal. A controller(23) is connected to the tester in order to apply the alignment stage drive signal. The tester includes a control circuit to transmit a control signal for moving the alignment stage to the Z-axis as much as integer times when the probe needle is not in contact with the electrode pad of the wafer.