发明名称 |
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE TO IMPROVE RELIABILITY OF GATE INTERCONNECTION |
摘要 |
PURPOSE: A method for fabricating a semiconductor device is provided to improve reliability of a gate interconnection by forming a micro gate electrode with good precision. CONSTITUTION: A gate insulation layer(2) is formed on a substrate(1). An electrode formation layer constituting a gate electrode is formed on the gate insulation layer. A silicon nitride layer(7) is formed on the electrode formation layer. A mask layer is formed on the silicon nitride layer. A resist pattern(9) is formed on the mask layer. The mask layer is patterned by using the resist pattern as a mask. A dry etching process using the patterned mask layer as a mask is performed to pattern the silicon nitride layer and the electrode formation layer. The mask layer is eliminated by a CMP(chemical mechanical polishing) process using the silicon nitride layer as a stopper layer.
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申请公布号 |
KR20040079836(A) |
申请公布日期 |
2004.09.16 |
申请号 |
KR20040004082 |
申请日期 |
2004.01.20 |
申请人 |
RENESAS TECHNOLOGY CORP. |
发明人 |
IKEMATSU YOSHIAKI;TERAUCHI TAKASHI |
分类号 |
H01L21/28;H01L21/3213;H01L21/336;H01L21/60;H01L21/768;H01L29/423;H01L29/49;H01L29/78;(IPC1-7):H01L21/336 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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