发明名称 |
Photoresist removal |
摘要 |
Disclosed herein is a composition and method for semiconductor processing. In one embodiment, a wet-cleaning composition for removal of photoresist is provided. The composition comprises a strong base; an oxidant; and a polar solvent. In another embodiment, a method for removing photoresist is provided. The method comprises the steps of applying a wet-cleaning composition comprising about 0.1 to about 30 weight percent strong base; about one to about 30 weight percent oxidant; about 20 to about 95 weight percent polar solvent; and removing the photoresist.
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申请公布号 |
US2004180300(A1) |
申请公布日期 |
2004.09.16 |
申请号 |
US20030389214 |
申请日期 |
2003.03.14 |
申请人 |
MINSEK DAVID W.;MURPHY MELISSA K.;BERNHARD DAVID DANIEL;BAUM THOMAS H. |
发明人 |
MINSEK DAVID W.;MURPHY MELISSA K.;BERNHARD DAVID DANIEL;BAUM THOMAS H. |
分类号 |
C11D7/06;C11D7/32;C11D7/50;C11D11/00;G03F7/42;H01L21/306;H01L21/311;(IPC1-7):G03F7/26;B08B6/00 |
主分类号 |
C11D7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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